C - Chemistry – Metallurgy – 23 – C
Patent
C - Chemistry, Metallurgy
23
C
C23C 14/22 (2006.01) B22F 3/14 (2006.01) B22F 7/06 (2006.01) C23C 14/34 (2006.01)
Patent
CA 2375783
The invention relates to a process for manufacturing an evaporation source for physical vapour deposition. The evaporation source comprises the actual sputtering target with an aluminium component and one or more further components as well as a backing plate made from a material having better thermal conductivity than the target. According to the invention the backing plate made of a powdery starting material is pressed, together with the powdery components of the sputtering target, into sandwiched powder fractions and then formed.
L'invention concerne un procédé de fabrication d'une source d'évaporation destinée à la séparation de vapeur physique. Ladite source d'évaporation est constituée de la cible de pulvérisation comportant une composante aluminium et ou une plusieurs autres composantes, ainsi que d'une plaque support réalisée dans un matériau présentant une conductivité thermique supérieure à celle de la cible. Selon l'invention, la plaque support est produite par compression d'un matériau de base pulvérulent et des composantes pulvérulentes de la cible de pulvérisation en couches de fractions pulvérulentes superposées, et formage consécutif.
Polcik Peter
Schonauer Stefan
Wilhartitz Peter
Fetherstonhaugh & Co.
Plansee Aktiengesellschaft
Plansee Se
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