C - Chemistry – Metallurgy – 23 – C
Patent
C - Chemistry, Metallurgy
23
C
75/1.3
C23C 8/00 (2006.01) C23C 8/68 (2006.01)
Patent
CA 1188549
ABSTRACT OF THE DISCLOSURE A process for manufacturing a boride dispersed copper alloy by preparing a metallic material having a surface portion comprising at least one of Al, As, Cd, Co, Cr, Fe, Mg, Mo, Nb, Pt, Ta, W and Zr, and copper or an alloy thereof, and diffusing boron into the surface portion. The resulting material includes fine boride particles uniformly dispersed in the surface portion and is useful as a material for electrical contacts or sliding parts due to its high wear, adhesion and arc resistance and high electrical conductivity.
404982
Arai Tohru
Fujita Hironori
Kasuya Osami
Mizuno Jiro
Ono Koichi
Kabushiki Kaisha Tokai Rika Denki Seisakusho
Kabushiki Kaisha Toyota Chuo Kenkyusho
Smart & Biggar
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