Process for manufacturing multilayer ceramic chip carrier...

Details Process for manufacturing multilayer ceramic chip carrier... Process for manufacturing multilayer ceramic chip carrier...

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H05K 3/46 (2006.01) C04B 35/632 (2006.01) C04B 35/638 (2006.01) C04B 41/51 (2006.01) C04B 41/53 (2006.01) C04B 41/88 (2006.01) C04B 41/91 (2006.01) H01L 21/48 (2006.01) H05K 1/03 (2006.01) H05K 3/00 (2006.01)

Patent

CA 1167979

TITLE PROCESS FOR MANUFACTURING MULTILAYER CERAMIC CHIP CARRIER MODULES ABSTRACT Preparing multilayer ceramic (MLC) modules by injection molding a mixture of a fine particulate such as alumina and a binder into a mold containing predesigned ridges and pins. The product is a green body layer of ceramic containing grooves and vias that is thereafter metallized with a conductive paste and laminated to other like layers of ceramic. Solvent extraction of the binder and sintering of the MLC forms the module.

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