Process for manufacturing printed circuit boards

Details Process for manufacturing printed circuit boards Process for manufacturing printed circuit boards

C - Chemistry, Metallurgy

23

F

356/12

C23F 1/02 (2006.01) H05K 3/06 (2006.01) H05K 3/24 (2006.01) H05K 3/34 (2006.01) H05K 3/10 (2006.01) H05K 3/18 (2006.01) H05K 3/28 (2006.01) H05K 3/38 (2006.01) H05K 3/42 (2006.01)

Patent

CA 1108306

ABSTRACT OF THE INVENTION Printed circuits are fabricated by a process which employs initial chemical deposition of copper on a predrilled substrate followed by electroplating build-up of conductors to desired pattern. The conductors are then passivated by thinly plating them with a mechanically durable, chemically passive metal. To provide solder compatibility in areas where connections are to be made to the printed circuits, a plating of tin/lead is applied in those areas while masking all other areas to eliminate plating. The remaining exposed copper is then etched away. An insulating solder mask is then applied. -1-

308143

Affiliated with

Also associated with

Rating

Process for manufacturing printed circuit boards does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Process for manufacturing printed circuit boards, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process for manufacturing printed circuit boards will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-661054