C - Chemistry – Metallurgy – 25 – D
Patent
C - Chemistry, Metallurgy
25
D
C25D 5/10 (2006.01)
Patent
CA 2075306
ABSTRACT A method of electrochemically depositing a crushable copper layer on a base surface of aluminum or nickel includes controlling the current density during the electrodeposition such that, over at least a portion of the time during which the copper is being deposited, the current density level is high enough to ensure that at least some of the copper atoms are deposited with gaps and interstices between them. The crushable deposition of other metals is also contemplated.
Bradoc Technology Inc.
Sim & Mcburney
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