Process for metalizing non-conductive substrates

Details Process for metalizing non-conductive substrates Process for metalizing non-conductive substrates

C - Chemistry, Metallurgy

23

C

26/127, 117/156,

C23C 18/20 (2006.01) C23C 18/18 (2006.01) C23C 18/28 (2006.01) C23C 18/30 (2006.01) H05K 3/38 (2006.01) H05K 3/42 (2006.01)

Patent

CA 1262517

ABSTRACT OF THE DISCLOSURE Non-conductive surfaces, particularly through-hole surfaces in double-sided or multi-layer printed circuit board, axe treated (conditioned) to receive void-free, adherent electroless metal coatings by contact of the surfaces with an organosilane preparatory to catalyzation and metallization.

545014

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