Process for metallized imaging

Details Process for metallized imaging Process for metallized imaging

C - Chemistry, Metallurgy

23

C

117/64, 117/77

C23C 18/30 (2006.01) C23C 18/16 (2006.01) C23C 18/20 (2006.01) H05K 3/10 (2006.01)

Patent

CA 1266590

ABSTRACT OF THE DISCLOSURE Formation of well-adhered metal layers on aromatic polymeric substrates through a two-step process is based upon reversible charge storage in the electroactive center- containing polymeric substrate. Articles particularly useful for electronic, imaging and solar applications are produced. The process disclosed may be a totally additive process such that articles can be produced in a continuous manner.

542142

Affiliated with

Also associated with

Rating

Process for metallized imaging does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Process for metallized imaging, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process for metallized imaging will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1251772