C - Chemistry – Metallurgy – 23 – C
Patent
C - Chemistry, Metallurgy
23
C
117/89, 204/91
C23C 18/28 (2006.01) C23C 18/20 (2006.01) H05K 3/18 (2006.01) H05K 3/38 (2006.01)
Patent
CA 1337035
An improved process for depositing strongly adhering metallic coatings on substrate surfaces by wet chemical methods comprises treating the surfaces with a primer before activation. The materials produced by the process are emin- ently suitable for the shielding of electromagnetic waves.
596154
Dederichs Reinhold
Gizycki Ulrich von
Merten Rudolf
Sirinyan Kirkor
Williams John Lewis
Aktiengesellschaft Bayer
Corporation Bayer
Dederichs Reinhold
Gizycki Ulrich von
Merten Rudolf
LandOfFree
Process for metallizing substrate surfaces does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Process for metallizing substrate surfaces, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process for metallizing substrate surfaces will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-1209714