Process for molding on a substrate carrying a sealing ridge

Details Process for molding on a substrate carrying a sealing ridge Process for molding on a substrate carrying a sealing ridge

B - Operations, Transporting

29

C

B29C 67/24 (2006.01) B29C 45/14 (2006.01) B29C 45/26 (2006.01)

Patent

CA 2508615

A process of molding a component (20) on a substrate (18) utilizes a substrate (18) having a peripheral flange that projects into a parting line between mold segments defining a mold cavity, wherein the flange (28) has a projecting, continuous circuitous ridge (32, 34) that forms a seal between the substrate and an upper mold segment (12). The process allows a substantially flash free molded component to be formed directly on a substrate (18), thus eliminating the need for a separate flash removal step.

L'invention concerne un procédé permettant de mouler un composant (20) sur un substrat (18) et consistant à utiliser le substrat (18) doté d'un bord périphérique en saillie dans une ligne de joint d'un moule entre des segments du moule définissant une cavité du moule, le bord (28) comprenant une saillie (32, 34) continue et en circuit, formant un joint entre le substrat et un segment (12) supérieur du moule. Le procédé permet de former directement un composant moulé sensiblement exempt de bavure sur le substrat (18), éliminant ainsi l'étape distincte nécessaire d'élimination de bavure.

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