Process for moulding plastics

B - Operations – Transporting – 29 – C

Patent

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Details

B29C 39/40 (2006.01) B29C 33/00 (2006.01) B29C 45/00 (2006.01) B29C 45/27 (2006.01) C08K 7/00 (2006.01) C08L 63/00 (2006.01)

Patent

CA 2126168

Abstract of the Disclosure Process for Moulding Plastics The present invention provides a process for the manufacture of a moulded article which comprises introducing a curable epoxy resin composition to a mould which is at a temperature high enough to initiate curing of the resin and supplying further resin under pressure to compensate for shrinkage of the composition, the epoxy resin containing coarse decorative particles therein, wherein the epoxy resin is introduced into the mould through a gap having a length which is 30 to 100% of that dimension of the moulded product being made which is adjacent to the gap and a width whichis at least twice the maximum size of the decorative particles.

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