Process for planarizing a substrate

Details Process for planarizing a substrate Process for planarizing a substrate

H - Electricity

01

L

117/109

H01L 23/24 (2006.01)

Patent

CA 1223782

ABSTRACT OF THE INVENTION PROCESS FOR PLANARIZING A SUBSTRATE A surface coating of high glass temperature and superior mechanical properties along with excellent planarization and gap filling is used to coat substrates. The coating comprises a polyamide alkyl ester from a pyromellitic alkyl diester and a para-linked aromatic diamine dissolved in a solvent containing at least 10% of a co-solvent boiling above 220°C.

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