C - Chemistry – Metallurgy – 09 – J
Patent
C - Chemistry, Metallurgy
09
J
402/1, 26/182, 4
C09J 5/10 (2006.01) B65D 8/00 (2006.01)
Patent
CA 1188031
Abstract of the Disclosure Disclosed is a process for the preparation of metallic bottles which comprises lap-bonding circum- ferential open end portions of upper and lower members, each consisting of a formed cup of a metal, said process being characterized by using at least one thermoplastic resin adhesive having a water absorption of less than 2%, as measured at a temperature of 23°C and a relative humidity of 80%, and an elasticity contribution ratio [R(t)t=1] of from 1 x 10-4 to 5 x 10 -1, defined by the following formula: R(t)t=1 =J(t) rec, t=1/J(t)t=1 wherein J(t)t=1 represents a creep compliance at a time constant of 1 second when the adhesive is caused to creep at a temperature higher by 30°C than the melting point of the adhesive under a shear stress of 50 to 5,000 dyne/cm2, and J(t)rec,t=1 represents an equilibrium recovery creep compliance when the adhesive is caused to creep under the same conditions as de- scribed above and the adhesive is then let to recover,
412507
Morfuji Akihiko
Taira Kazuo
Ueno Hiroshi
Smart & Biggar
Toyo Seikan Kaisha Ltd.
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