Process for preparing latent curing agents for epoxy resins,...

C - Chemistry – Metallurgy – 08 – G

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C08G 69/00 (2006.01) C07D 521/00 (2006.01) C08G 59/40 (2006.01) C08G 59/50 (2006.01) C08G 59/54 (2006.01) C08L 63/00 (2006.01)

Patent

CA 2080422

ABSTRACT The invention relates to a process for preparing latent curing agents based on imidazole or N-aminoalkylimidazole/acrylic acid reaction products containing amido, and optionally amino, groups for epoxy resins and to their use in the manufacture of fiber-reinforced printed circuit boards for the electrical industry.

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