Process for preparing low dielectric polyimides

Details Process for preparing low dielectric polyimides Process for preparing low dielectric polyimides

C - Chemistry, Metallurgy

08

G

402/218, 402/3

C08G 73/10 (2006.01)

Patent

CA 1312990

Abstract Linear aromatic polymers having low dielectric constants are produced by minimizing the electronic interactions between polymer chains. This is accomplished by one or more of the following means: incorporating separator or linking groups in the polymer molecular structure producing physical kinks or dissymmetry in the polymer chains; incorporating a bulky group in the polymer molecular structure; and incorporating one or more fluorine atoms in the polymer molecular structure. Low dielectric aromatic condensation polyimides prepared according to this invention are highly suitable as film and coating materials for both industrial and aerospace applications where a high degree of electrical insulation, moisture resistance, mechanical strength, and thermal stability are required.

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