Process for preparing organopolysiloxane resins containing...

C - Chemistry – Metallurgy – 08 – G

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C08G 77/06 (2006.01) C08G 77/08 (2006.01) C08G 77/10 (2006.01) C08G 77/20 (2006.01)

Patent

CA 1120185

ABSTRACT OF THE DISCLOSURE A process is provided for preparing organopolysiloxane resins containing Si-bonded vinyl groups. The process comprises heating, to a temperature of from 85 to 95°C., a mixture con- taining three ingredients. The first, (A) is an organopolysiloxane having at least 0.1 percent by weight of certain specified Si- bonded hydroxyl groups and at least 50 mol percent of the units of the organopolysiloxane are monoorganosiloxane units (RSiO?). The second, (B) is an organosiloxane containing from 2 to 10 silicon atoms per molecule, in which substantially all the silicon valences which are not satisfied by siloxane oxygen atoms, are satisfied by SiC-bonded hydrocarbon radicals for each silicon atom and at least one of the siloxanes (A) and (B) has an average of at least one SiC-bonded vinyl group. The third, (C), is an acid activated bleaching clay. By this procedure, the water re- leased during the heating step by the condensation of the Si-bonded hydroxyl groups is retained in the reactive mixture. The organo- polysiloxane resins thus prepared are substantially free of Si- bonded hydroxyl groups, and may be molded without forming voids.

327913

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