C - Chemistry – Metallurgy – 08 – G
Patent
C - Chemistry, Metallurgy
08
G
96/152, 402/246,
C08G 65/32 (2006.01) C08F 8/00 (2006.01) C08F 8/14 (2006.01) C08F 8/26 (2006.01) C08G 65/332 (2006.01) C08G 65/333 (2006.01) C08G 85/00 (2006.01) G03F 7/038 (2006.01)
Patent
CA 1046683
ABSTRACT OF THE DISCLOSURE The present invention provides a process for preparing a photosensitive polymer by reacting a polymer having an active halogen atom with an .alpha.,.beta.-unsturated carboxylic acid having the formula (I). Ar-(YC = CX)n - ? - OH (I) wherein X and Y reprerent hydrogen atom, halogen atom, cyano group or nitro group; Ar represents an aryl group which can be substituted with a nitro or cyano group and m is 1 or 2, in an aprotic polar solvent, which is characterized in that the reaction is conducted in the presence of a bicyclic amidine having the formula (II) Image wherein R1 represents C1-11 alkylene group which can be substitutcd by a lower alkyl group and R2 represents propylene group which can be substituted by a lower alkyl group. A photosensitive composition may be made by dissolving the photosensitive polymer in a suitable solvent, and adding a conventional sensitizer, if necessary with a stabilizer plasticizer and various dyes and pigments. The photosensitive compositions can be used as photoresists for preparation of printed circuits, for preparation of IC, for chemical milling, for printing plates for relief printing and intaglio processes and for photoprinting plates. They can also be used as photocurable paint, and as photoadhesives.
193832
Eguchi Chihiro
Fukutani Hideo
Miura Konoe
Takahashi Yoshihiro
Torige Kazuo
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