Process for preparing printed circuit board thru- holes

Details Process for preparing printed circuit board thru- holes Process for preparing printed circuit board thru- holes

H - Electricity

05

K

356/18

H05K 3/42 (2006.01) H05K 3/40 (2006.01)

Patent

CA 1202734

ABSTRACT OF THE DISCLOSURE Multilayer printed circuit boards typically made of epoxy glass resin with copper innerlayers having drilled thru-holes are well known. The present invention relates to preparing these drilled holes for the application of the conductive metal, usually electrolessly plated copper, and more specifically, relates to chemically treating the surface of the thru-holes to increase its effective surface area to provide improved coverage of the metal deposited on the surface.

455904

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