Process for preparing, prior to filling, a wafer cornet,...

A - Human Necessities – 21 – C

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

A21C 15/00 (2006.01) A23G 9/28 (2006.01)

Patent

CA 2562382

Process for preparing a cornet consisting of a substantially conical wafer (22) prior to the filling of said cornet with an ice-cream; in order to preserve the crunchy nature of the wafer, the inner wall of the cornet is sprayed with liquid chocolate (23); this chocolate solidifies rapidly in order to form a coating layer for separating the wafer and the ice-cream. The process is characterized in that the inside of the cornet is sprayed with an excess quantity of chocolate to guarantee that no coating-gap zone remains on the inner wall of the wafer, the excess liquid chocolate collecting, under gravity, at the bottom tip of the corner; prior to solidification of said excess, the excess is sucked out of the cornet, subsequent solidification of the coating layer thus making it possible to establish a continuous barrier over the inner wall of the wafer.

L'invention concerne un procédé de préparation d'un cornet constitué d'une gaufre (22) sensiblement conique avant son remplissage afin de conserver la nature croustillante de la gaufre. La paroi interne du cornet est pulvérisée de chocolat liquide (23) qui se solidifie rapidement afin de former une couche de revêtement permettant de séparer la gaufre de la glace. Ce procédé est caractérisé en ce que l'intérieur du cornet est pulvérisé d'un excédent de chocolat pour garantir que la paroi interne de la gaufre ne présente aucune zone sans revêtement. Le chocolat liquide excédentaire est collecté, par gravité, dans la pointe du fond du cornet avant la solidification de cet excédent, l'excédent étant évacué du cornet par aspiration. La solidification consécutive de la couche de revêtement permet ainsi d'établir une barrière continue sur toute la paroi interne de la gaufre.

LandOfFree

Say what you really think

Search LandOfFree.com for Canadian inventors and patents. Rate them and share your experience with other people.

Rating

Process for preparing, prior to filling, a wafer cornet,... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Process for preparing, prior to filling, a wafer cornet,..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process for preparing, prior to filling, a wafer cornet,... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFCA-PAI-O-1877447

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.