Process for preparing semiconductor device

Details Process for preparing semiconductor device Process for preparing semiconductor device

H - Electricity

01

L

H01L 21/20 (2006.01) H01L 21/225 (2006.01) H01L 21/265 (2006.01) H01L 21/285 (2006.01) H01L 21/3215 (2006.01) H01L 21/331 (2006.01)

Patent

CA 2050781

A process for preparing a semiconductor device comprises exposing at least a part of the main surface of a semiconductor substrate, forming a layer comprising the same main component as the above substrate, forming a flattening agent layer on the surface of said layer, removing the above layer and the flattening agent layer at the same time and injecting an impurity after said removing step.

Procédé pour préparer un dispositif à semiconducteur et comprenant les étapes suivantes : mettre à nu au moins une partie de la surface principale d'un substrat de semiconducteur, former une couche comprenant le même composant principal que le substrat précité, former une couche d'agent de matité sur la surface de ladite couche, enlever la couche précitée et la couche d'agent de matité en même temps et injecter une impureté après ladite étape d'enlèvement.

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