Process for preparing spherical copper fine powder

Details Process for preparing spherical copper fine powder Process for preparing spherical copper fine powder

B - Operations, Transporting

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B22F 9/28 (2006.01) C22B 15/00 (2006.01) H01B 1/02 (2006.01)

Patent

CA 1330398

Abstract In a process for preparing a spherical copper fine powder having an average grain size ranging from 0.1 µm to a few µm, by use of chemical vapor deposition of cuprous chloride vapor with a reducing gas, the vapor deposition zone is maintained at a temperature ranging 900°C to less than 1150°C and the generated particles are quenched subsequently. The generated powder is utilized as a conductive powder which is the main component of a conductive paste.

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