C - Chemistry – Metallurgy – 08 – F
Patent
C - Chemistry, Metallurgy
08
F
400/1, 402/578,
C08F 2/18 (2006.01) C08F 12/02 (2006.01) C08J 3/20 (2006.01)
Patent
CA 1156399
Abstract of the Disclosure Styrenic polymer particles having a uniform particle size distribution are prepared without the formation of fine polymer powders. The suspension polymerization process which comprises providing a stirred, aqueous suspension of polymeric seed particles, adding gradually to the suspension styrenic monomer and poly- merizing it therein, and continuing the addition of monomer as the polymerization proceeds, may be improved by introducing the styrenic monomer below the surface of the suspension.
375954
Kelley Donald J.
Slovenkai Stephen V.
Williams David J.
American Hoechst Corporation
Bereskin & Parr
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