B - Operations – Transporting – 27 – N
Patent
B - Operations, Transporting
27
N
154/97
B27N 3/00 (2006.01) B27N 1/00 (2006.01) C08L 61/20 (2006.01) C08L 97/02 (2006.01) C08L 1/00 (2006.01)
Patent
CA 1129761
ABSTRACT OF THE DISCLOSURE The present invention provides in a process for prepar- ing a wood chip board in which the wood raw material is subjected to a cutting operation and to a subsequent drying step so as to achieve a moisture content of less than 4% by weight, whereafter the wood chip material is glued with an aqueous liquor of an amino- plast and then the glued chip material thus obtained is compressed under heat, the improvement in which the glueing is effected with a liquor having a solid resin content in the range between 20 and 35% by weight, the amount of glue used containing less than 6% by weight of solid resinbased on the total chip material weight cal- culated as absolutely dry material.
337180
Marks & Clerk
Osterreichische Hiag-Werke Aktiengesellschaft
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