C - Chemistry – Metallurgy – 23 – C
Patent
C - Chemistry, Metallurgy
23
C
18/63, 117/74, 2
C23C 14/14 (2006.01) H05K 1/03 (2006.01) H05K 3/02 (2006.01) H05K 3/14 (2006.01) H05K 3/38 (2006.01) H05K 3/46 (2006.01)
Patent
CA 2017230
Abstract A board capable of forming a precision fine-line circuit is produced by the substractive method comprising that a base plate prepared by molding a liquid-crystal polyester resin composition comprising a melt-processable polyester (liquid-crystal polyester) capable of forming an anisotropic molten phase and an inorganic filler added thereto is treated to form a metallic coating on the surface thereof by sputtering, ion plating or vacuum deposition while heating said surface to a temperature of 60°C or above in a vacuum tank.
Akeda Tomoyuki
Suzuki Yoshiharu
Polyplastics Co. Ltd.
Smart & Biggar
LandOfFree
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