Process for producing copper-laminated base material for...

Details Process for producing copper-laminated base material for... Process for producing copper-laminated base material for...

H - Electricity

05

K

154/37, 154/89

H05K 3/46 (2006.01) B29C 70/08 (2006.01) B29C 70/50 (2006.01) B32B 15/14 (2006.01) H05K 3/02 (2006.01) H05K 1/03 (2006.01)

Patent

CA 1264278

ABSTRACT OF THE DISCLOSURE: A metal-laminated base material for printed circuit boards is produced in a double-belt press. Sheets of laminated material impregnated with an accelerated resin system and prehardened are preheated in a preheating zone, before running into the pressure-effective zone of the double-belt press, and are supplied together with the metal foils to the heating region of the pressure-effective zone. Here, the individual layers are pressed to form the base material. The base material is preferably cooled under pressure in the cooling region of the pressure-effective zone, if appropriate heat-treated, trimmed at the edges and cut to length. The process provides uniform base-material boards of perfect quality.

478573

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