Process for producing copper through-hole printed circuit board

Details Process for producing copper through-hole printed circuit board Process for producing copper through-hole printed circuit board

H - Electricity

05

K

149/10

H05K 3/06 (2006.01) C23F 1/02 (2006.01) H05K 3/00 (2006.01) H05K 3/42 (2006.01)

Patent

CA 1238559

Abstract of the Disclosure Disclosed is a process for producing a copper through- hole printed circuit board, which comprises forming a required pattern on a copper-clad laminated plate using a resist ink soluble in an alkaline aqueous solution, immersing the copper-clad laminated plate in an aqueous solution of a salt of an alkylimidazole compound represented by the following general formula Image wherein R2 represents an alkyl group having 5 to 21 carbon atoms, R4 represents a hydrogen atom or a methyl group, and HA represents an organic or inorganic acid, to form on the copper surface of the copper-clad laminated plate an etching resist film composed of the alkylimidazole compound, drying the resulting copper-clad laminated plate, and then treating it with an alkaline etching solution.

492678

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