Process for producing extremely flat microcrystalline...

C - Chemistry – Metallurgy – 30 – B

Patent

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Details

C30B 29/04 (2006.01) C01B 31/06 (2006.01) C23C 14/06 (2006.01) C23C 14/28 (2006.01)

Patent

CA 2527124

With respect to the conventional diamond thin film grown by the PLD method, the size of diamond crystal grains is on the order of 1 µm and the film surface is uneven. There is provided a process for producing a diamond thin film by a laser ablation method, comprising heating a substrate at 450 to 650~C, creating a hydrogen atmosphere in a reaction chamber, setting laser energy for 100 mJ or more and providing a spacing of 15 to 25 mm between a target and the substrate so as to form a supersaturation of atomic hydrogen and carbon between the target and the substrate, and further comprising realizing a hydrogen atmosphere pressure sufficient to completely selectively etch off sp2 bond component (graphite component) from the sp2 bond component and sp3 bond component deposited on the substrate so as to effect growth of a single-phase superflat microcrystalline diamond thin film substantially not containing any non-diamond components.

Comparativement à la croissance classique de film mince de diamant au moyen du procédé PLD, les dimensions des grains cristallins du diamant sont de l'ordre de 1 µm et la surface du film est inégale. L'invention concerne un procédé de production d'un film mince de diamant au moyen d'un procédé d'ablation laser consistant à chauffer un substrat à une température comprise entre 450 et 650 ·C, à créer une atmosphère d'hydrogène dans une chambre de réaction, à régler l'énergie laser pour au moins 100mJ et à ménager un espacement entre 15 et 25 mm entre une cible et le substrat, de manière à former une supersaturation d'hydrogène atomique et de carbone entre la cible et le substrat et consistant également à créer une pression de l'atmosphère d'hydrogène suffisante pour graver totalement et de manière sélective le composant (composant graphite) de liaison sp2 afin de le séparer des composants de liaison sp2 et sp3 déposés sur le substrat, de manière à exécuter la croissance d'un film mince de diamant microcristallin super plat et à phase unique et ne contenant sensiblement pas de composant non-diamant quelconque.

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