H - Electricity – 05 – K
Patent
H - Electricity
05
K
356/5
H05K 3/46 (2006.01) H01L 21/48 (2006.01) H05K 1/03 (2006.01) H05K 1/09 (2006.01)
Patent
CA 1237535
PROCESS FOR PRODUCING MULTILAYER CERAMIC CIRCUIT BOARD WITH COPPER ABSTRACT OF THE DISCLOSURE A process for producing a multilayer ceramic circuit board with copper comprising the steps of: forming green sheets by doctoring a slurry which comprises 100 parts by weight of glass ceramic particles, 5 to 20 parts by weight of a thermally depolymerizable resin binder, 2 to 10 parts by weight of a plasticizer, and up to 2 parts by weight of a fatty acid ethylene oxide adduct type deflocculant. The glass ceramic comprises 20 to 70% by weight of alumina, and 30 to 80% by weight of SiO2-B2O3 glass. Forming via holes through the green sheets, screen-printing a copper paste on the green sheets and laminating the green sheets, thereby forming a multilayer structure and firing the multilayer structure in a non-oxidizable atmosphere.
495834
Imanaka Yoshihiko
Kamehara Nobuo
Kurihara Kazuaki
Ogawa Hiromi
Tsukada Mineharu
Fujitsu Limited
Mcfadden Fincham
LandOfFree
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