C - Chemistry – Metallurgy – 08 – L
Patent
C - Chemistry, Metallurgy
08
L
400/1310, 400/54
C08L 61/34 (2006.01) C08G 8/00 (2006.01) C08G 14/06 (2006.01) C08K 3/16 (2006.01)
Patent
CA 1123531
ABSTRACT OF THE DISCLOSURE Particulate, solid, heat-reactive, filler- containing resole molding composition are directly produced by reacting a phenol, formaldehyde, and an amine in an aqueous medium containing a water-insoluble filler material having reactive sites on the surface thereof which chemically bond with a phenolic resin and protective colloid to produce an aqueous suspension of a particulate filler-containing resole, and recovering the filler-containing resole from said suspension.
316530
Schultz Sidney J.
Wynstra John
Hopley William G.
Union Carbide Corporation
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