Process for producing printed circuit boards using a...

Details Process for producing printed circuit boards using a... Process for producing printed circuit boards using a...

H - Electricity

05

K

H05K 3/46 (2006.01) H05K 1/11 (2006.01) H05K 3/00 (2006.01) H05K 3/40 (2006.01) H05K 3/42 (2006.01) H05K 1/00 (2006.01) H05K 1/05 (2006.01) H05K 3/38 (2006.01)

Patent

CA 2114954

P0756.PCT - 38 - ABSTRACT In the metal-clad laminate according to the invention it is assumed that the requirements concerning the mechanical strength are functionally separated from the circuit connection requirement, so as to be able to bring the circuit connection, particularly for signals, "closer" to the electrotechnical characteri- stics of the chips. For this purpose and without taking account of the mechani- cal strength of the substrate, the layout miniaturization is optimized. In placeof a circuit board (MCM), a laminate which can be built up to a circuit board is produced. The inventive laminate comprises an extremely thin foil with a plurality of extremely small holes simultaneously etched in an etching process. The hole diameter can be reduced by almost an order of magnitude (up to 20µm), which e.g. permits a sub-100 µm technology. Such a laminate is not used as a mechanical support and is only provided for signal guidance. The effect of the miniaturization can be seen in the diameter for the plated-through holes. With a hole diameter reduction there is an increase in the current path density, which gives over 10000 plated-through holes per dm2. The drawing shows the compression ratio compared with standard technology. (Fig. 6g)

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