H - Electricity – 05 – K
Patent
H - Electricity
05
K
356/1
H05K 3/10 (2006.01) C25D 5/44 (2006.01) H05K 3/02 (2006.01)
Patent
CA 1150849
CD-7083 PROCESS FOR PRODUCING STRIPPABLE COPPER ON AN ALUMINUM CARRIER AND THE ARTICLE SO OBTAINED Abstract of the Disclosure A process is provided for producing a composite struc- ture suitable for use in connection with the manufacture of printed circuits which includes a carrier layer of aluminum and a covering layer of copper which structure is characterized by the fact that the copper layer is tenaciously bonded to the car- rier layer but readily separable therefrom by mechanical means without destroying the integrity of the copper layer which pro- cess comprises the steps of (a) providing a layer of aluminum foil, (b) cleaning at least one major surface of the aluminum foil to remove surface contaminants therefrom, (c) positioning the aluminum foil in a suitable electrolyte and passing electric current therethrough in such a manner that the foil is rendered cathodic to activate the surface of the foil, (d) positioning the activated foil in a suitable electrolyte and passing elec- trical current therethrough in such a manner that the foil is rendered anodic and a layer of aluminum oxide is formed on the surface thereof, and (e) electrodepositing a thin layer of copper on the anodically treated surface of aluminum foil.
367295
Ga-Tek Inc. (doing Business As Gould Electronics Inc.)
Gould Inc.
Kappel Ludlow Llp
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