Process for producing subsequently conditionable contact...

Details Process for producing subsequently conditionable contact... Process for producing subsequently conditionable contact...

H - Electricity

05

K

H05K 3/40 (2006.01) H05K 1/11 (2006.01) H05K 1/00 (2006.01) H05K 1/05 (2006.01) H05K 3/00 (2006.01) H05K 3/38 (2006.01) H05K 3/42 (2006.01) H05K 3/46 (2006.01)

Patent

CA 2114792

- 10 - ABSTRACT The method for producing subsequently contactable contact points or pads between two conducting path planes of a circuit carrier separated from one another by an electrically insulating layer offers the possibility of e.g. producing a basic conductor diagram, which can be quickly subsequently easily adapted to the corresponding needs. By making windows in the conducting path planes in such a way that during the following through-etching of the elect- rically insulating layer by undercutting land-like parts connected to the opening periphery are exposed between or in the openings and said exposed, land-like parts can be contacted with electrically conductive parts of the other conducting path plane by mechanically bending together said conductive paths in order to bring about an electrical connection. (Fig. 6b)

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