Process for providing a landless through-hole connection

Details Process for providing a landless through-hole connection Process for providing a landless through-hole connection

H - Electricity

01

K

356/16

H01K 3/10 (2006.01) H05K 3/20 (2006.01) H05K 3/42 (2006.01)

Patent

CA 1245774

PROCESS FOR PROVIDING A LANDLESS THROUGH-HOLE CONNECTION ABSTRACT At least two conductors are electrically connected through a dielectric material by providing a dielectric material having a first conductor on a first surface thereof and a temporary support layer covering the first conductor and the first surface of the dielectric material. A second surface on the dielectric material opposite the first surface is provided with a second conductor and a temporary support layer covering the second conductor and second surface of the dielectric material. Intersticial through-holes are provided to connect the first and second conductors. The through-holes are plated with an electrical conductor to thereby electrically connect the first and second conductors. The support layers are then mechanically removed such as by peeling to thereby provide a landless electrical connection between the first and second electrical conductors.

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