Process for providing a polymer-electroplate bond of...

Details Process for providing a polymer-electroplate bond of... Process for providing a polymer-electroplate bond of...

C - Chemistry, Metallurgy

25

D

204/18, 204/22.5

C25D 5/56 (2006.01)

Patent

CA 1120420

Abstract of the Disclosure A process for improving bond stability between an electrodeposit of a group VIII metal and a conductive plastic substrate containing a polymer and a sulfur moiety adapted to produce an initial bond between said conductive plastic substrate and said group VIII metal comprising aging of the plastic substrate prior to electrodeposition and then establishing said initial bond between the polymer and the group VIII metal through the means of said sulfur moiety by electrodeposition under conditions of high electrodeposition efficiency and thereafter isolating the metal-polymer bond from contact with nascent hydrogen. An electrodeposition copper layer, on top of the group VIII metal can be usefully employed to isolate the initial bond from nascent hydrogen.

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