C - Chemistry – Metallurgy – 25 – C
Patent
C - Chemistry, Metallurgy
25
C
204/68
C25C 1/12 (2006.01) C23F 1/46 (2006.01)
Patent
CA 1256819
Abstract of the Disclosure Ammoniacal solutions that have been employed as a bath for etching copper such as in the manufacture of printed circuits are reconstituted or regenerated to substantially fully remove excessive copper solute therefrom and retain the ammonia content thereof in such a manner as to enable a continuous reuse of the etching solution. The process is conducted in such a manner that no contaminating metal powder, compounds or sludge are formed. The reconditioning is effected by introducing used copper solute containing ammonium etching solution into an electrolytic bath in which cathodic and anodic electrode containing compartments are defined by a cationic permeable membrane therebetween with the cathodic compartment having an electronegative cathode electrode plate therein. Normal corrosion current generation and flow in the cell is substantially restricted and the copper content of the solution is substantially solely plated out as a pure metal slab on the cathode plate electrode by applying a sufficient external direct current potential to the cell, to thereby negate normal current flow of the cell, deterioration of the cathode, and in such a manner as to prevent formation of copper powder, metal compounds and sludges within the cell from either the cathode metal or the copper solute content of the ammoniacal etching solution. The operation is conducted in such a manner as to con- serve the ammonia content of the used copper etch solution and enable the reconditioned solution to be reused with a minimized loss of its active etching ingredients.
477054
Lancy International Inc.
Riches Mckenzie & Herbert Llp
LandOfFree
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