Process for reducing the total halide content of an epoxy resin

Details Process for reducing the total halide content of an epoxy resin Process for reducing the total halide content of an epoxy resin

C - Chemistry, Metallurgy

08

G

402/250, 402/43,

C08G 59/14 (2006.01) C08G 59/00 (2006.01)

Patent

CA 1257446

ABSTRACT OF THE DISCLOSURE The total halide content of epoxy resins is reduced by heating a resin containing halide dissolved in a unique solvent system containing at least one ketone, at least one aromatic hydrocarbon and at least one compound containing at least one aliphatic hydroxyl group in the presence of an alkali metal hydroxide for a time sufficient to reduce the total halide content; washing the resin with water, a dilute aqueous solution of a weak inorganic acid or acid salt; and then recovering the resultant resin. The epoxy resin having a low halide content is used in the electronics industry as an encapsulant, potting compound electrical laminate, and the like.

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