Process for reflow soldering

Details Process for reflow soldering Process for reflow soldering

B - Operations, Transporting

23

K

113/86

B23K 1/00 (2006.01) B23K 1/19 (2006.01) B23K 35/38 (2006.01)

Patent

CA 2011030

A method of joining components to a substrate by reflow soldering with non-rosin-based flux containing solder is disclosed comprising heating the solder in the presence of the components in a low oxidizing atmosphere.

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