B - Operations – Transporting – 23 – K
Patent
B - Operations, Transporting
23
K
257/27, 113/90
B23K 31/02 (2006.01) B23K 1/00 (2006.01) B23K 1/08 (2006.01) B23K 1/19 (2006.01) B23K 35/26 (2006.01)
Patent
CA 1270812
14 52,842 ABSTRACT OF THE DISCLOSURE This is an article and process which provide the first essentially continuous high tin flow soldering method for attaching copper based fins to copper based tubing. This invention avoids sludge buildup in the reservoir and generally avoids lead carbonate formation when the heat exchanger is in service. In addition, a novel structure is produced having a braze like joint with eta phase layers adjacent to the copper based surfaces. The invention utilizes an essentially lead free, high tin solder cascade onto a preferably cool tube, generally with a limited time of contact between the liquid solder and the tube, and with a combination air quench and wipe to remove excess solder and solidify the remaining solder. Thus a braze like joint is achieved having better heat conduction and closer thermal expansion match. This finned heat exchanger tubing is generally useful for liquid to gas type heat exchangers and especially useful for hydrogen coolers for electrical generators.
517560
Hargrove Homer Gay
Kratz Jay Lewos
Sabatino Raymond Alexander
Weyant Perry Allen
Bereskin & Parr
Westinghouse Electric Corporation
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