H - Electricity – 05 – K
Patent
H - Electricity
05
K
356/12, 117/66
H05K 1/02 (2006.01) C23C 18/16 (2006.01) H01L 21/48 (2006.01) H05K 3/22 (2006.01) H05K 3/24 (2006.01)
Patent
CA 1207464
Process for Selectively Depositing a Nickel- Boron Coating Over a Metallurgy Pattern on a Dielectric Substrate and Products Produced Thereby Abstract A process for simultaneously selectively depositing a high purity nickel containing alloy (i.e. a nickel-boron alloy having a nickel content in excess of 93.5 percent) over a preformed metallurgy pattern (including the individual, electrically isolated con- tact pads and the seal band area thereon) on the top- side dielectric surface of a multi-layer ceramic module. The metallurgy pattern on such top-side surface of such module is appropriately catalyzed and then immersed in a bath which is essentially lead-free and which includes a source of nickel ions, a borane reducing agent, and an effective amount of an organic divalent sulfur compound, preferably thiodiglycollic acid. The contact pads and the seal band area so plated exhibit an exceptionally uniform layer of nickel-boron alloy, free of surface irregularities, which layer is char- acterized by low contact resistance, excellent wire bonding and eutectic diode bonding characteristics and is both crack-free at the time of its being deposited and remains crack-free under brazing conditions through- out the life of the component.
426397
Baudrand Donald W.
Fleming Rebecca P.
Gniewek John J.
Harvilchuck Joseph M.
Schmeckenbecher Arnold F.
International Business Machines Corporation
Osler Hoskin & Harcourt Llp
Richardson Chemical Company
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