Process for sensitizing articles for metallization and...

Details Process for sensitizing articles for metallization and... Process for sensitizing articles for metallization and...

C - Chemistry, Metallurgy

23

C

117/80

C23C 3/00 (1980.01)

Patent

CA 1066961

Abstract of the Disclosure.- Surfaces of articles are sensitized for the deposition of adherent metal from electroless metal solutions in contact therewith by prior treatment with an activatable complex of copper in a liquid medium formed from a solution comprising a mixture of halogen, cuprous and cupric components and thereafter forming a deposit. on the treated article surfaces of a water-insoluble derivative of the said complex. Such surface deposits are treated with a reducing agent or water to enhance their reception of metal in an electroless metal deposition bath.

225949

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