Process for sensitizing hole walls in non-metallic articles...

H - Electricity – 05 – K

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H05K 3/18 (2006.01)

Patent

CA 1055327

Abstract of the Disclosure.- The walls of holes in non- matallic articles are sensitized for deposition of metal from electroless metal solutions in contact therewith by treatment with a first medium including a compound or combination of compounds containing an element which in one of its states is catalytically active to electroless metal deposition thereby adsorbing on the walls in situ the element(s) and/or compound(s); thereafter treating the walls with at least one second medium to decrease the solubility of the compound or combination of compounds and simultaneously removing the excess; and simultaneously or sub- sequently, if necessary, treating the walls with one or more separate reducing agents to transfer said element(s) into a catalytically- active state.

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