Process for setting a latex of a film forming polymer

C - Chemistry – Metallurgy – 08 – K

Patent

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400/1612, 261/78

C08K 3/00 (2006.01) C08C 1/14 (2006.01) C08J 9/30 (2006.01) C08K 3/34 (2006.01) C08K 5/09 (2006.01) C08K 5/098 (2006.01) C08L 9/08 (2006.01) C08L 11/02 (2006.01) C08L 95/00 (2006.01) E01C 13/06 (2006.01)

Patent

CA 1182936

ABSTRACT OF THE DISCLOSURE Delayed action setting of a composition comprising an amonic latex of a film forming polymer is effected by the addition of a delayed action setting agent which is a mixture of:- (1) a compound containing a multivalent metal cation, which compound has a solubility in the range 0.1g to 150g per l00g of water at 20°C and which has a dissolution time greater than l minute, and (11) an alkali metal silico fluride Other film forming materials such as bitumen may be present in the composition. The process is particularly useful for mixtures of polychloroprene latex and bitumen emulsion, The compound (1) can be either one which gives or one which does not give exudation (or 'sweating') of water from the latex. A preferred compound of the former type is calcium sulphate hemihydrate. The preferred fluride (11) is sodium silico fluride. The composition may also contain inert non-hydraulic particulate filler which can be a hard filler, eg. sand or a deformable filler, eg. tyre crumbs, or a mixture of the two.

382485

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