Process for soldering allowing low ionic contamination...

Details Process for soldering allowing low ionic contamination... Process for soldering allowing low ionic contamination...

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B23K 1/08 (2006.01) B23K 1/20 (2006.01) B23K 31/02 (2006.01) B23K 35/36 (2006.01) B23K 35/363 (2006.01) H05K 3/34 (2006.01)

Patent

CA 2023928

14 PE-0166 TITLE PROCESS FOR SOLDERING ALLOWING LOW IONIC CONTAMINATION WITHOUT CLEANING OPERATION ABSTRACT A process for soldering a substrate surface which allows low ionic contamination without a cleaning operation which comprises (a) applying a stannous fluoride or eutectic mixture thereof to the substrate surface and (b) applying solder to the flux applied in (a). The stannous fluoride which is relatively inactive below its melting temperature can be applied to the substrate surface and the so treated substrate held for an extended period of time prior to soldering without any harmful effect on the substrate. The process is useful in electronic assembly that would include attachment of components to circuit boards, tinning of circuit boards, pretinning of component leads, connectors etc. 14

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