H - Electricity – 05 – K
Patent
H - Electricity
05
K
H05K 1/18 (2006.01) H01L 23/66 (2006.01) H05K 1/02 (2006.01) H05K 3/34 (2006.01)
Patent
CA 2311800
The invention concerns the surface mounting of a backset microwave package on a printed circuit. After the package (L1, L2, 1, 2, 3) has been accurately positioned against the printed circuit (L1', L2', 6, 7, 8), the connections are produced by soldering (S) the conducting elements (L1-L1', L2-L2') in direct contact. The chip (P) is enclosed in a sort of cage constituting a screen which replaces the conventional cover; said cage is formed by layouts (2-3, 7-8) borne respectively by the package and the printed circuit and linked together by metal links (Ha-Ha', Hb-Hb'). The invention is particularly applicable to packages operating in millimetric microwaves.
L'invention concerne le montage en surface d'un boîtier hyperfréquence retourné sur un circuit imprimé. Après un positionnement précis du boîtier (L1, L2, 1, 2, 3) contre le circuit imprimé (L1', L2', 6, 7, 8), les connexions se font par soudure (S) des éléments conducteurs (L1-L1', L2-L2') en contact direct. La puce (P) est enfermée dans une sorte de cage constituant un blindage qui remplace le capot classique; cette cage est formée par des plans de masse (2-3, 7-8) portés respectivement par le boîtier et le circuit imprimé et réunis entre eux par des liaisons métalliques (Ha-Ha', Hb-Hb'). Application, en particulier, aux boîtiers travaillant en hyperfréquences millimétriques.
Cachier Gerard
Daden Jean-Yves
Etourneau Pascal
Gohn-Devineau Muriel
Grancher Alain
Goudreau Gage Dubuc
Thomson-Csf
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