C - Chemistry – Metallurgy – 23 – C
Patent
C - Chemistry, Metallurgy
23
C
117/233, 117/75
C23C 18/20 (2006.01) C08J 7/12 (2006.01) C23C 18/28 (2006.01) H05K 1/03 (2006.01) H05K 3/18 (2006.01) H05K 3/38 (2006.01)
Patent
CA 1226180
Process for the adhesion-activation of polyamide sub- strates for electroless metallisation Abstract A mild activation process for the adhesion- activation of polyamide mouldings for electroless metal- lisation comprises treating the substrates, successively or simultaneously, with the solution of a mixture of CaC12, LiCl and/or MgC12 with AlC13, FeC13 and/or TiC14 in a lower alcohol and with an activator solution based on inorganic complex compounds of the formula Mn+ [Em+ Halz] in which M represents two hydrogen or alkal; metal atoms or one alkaline earth metal atom, Hal represents a halogen, preferably C1, and E represents a noble metal atom of the 1st or 8th subgroup of the periodic table, having the val- ency m and the coordination number z (z-m - n), or with customary colloidal or ionic systems of these noble metals.
466919
Gizycki Ulrich von
Merten Rudolf
Sirinyan Kirkor
Wolf Gerhard D.
Fetherstonhaugh & Co.
Gizycki Ulrich von
Merten Rudolf
Sirinyan Kirkor
Wolf Gerhard D.
LandOfFree
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