Process for the application of powder coatings to...

B - Operations – Transporting – 05 – D

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B05D 1/06 (2006.01) B05D 1/04 (2006.01) B05D 3/00 (2006.01) C23C 4/02 (2006.01) C23C 24/04 (2006.01) C23C 24/08 (2006.01) C23C 24/10 (2006.01)

Patent

CA 2395725

The present invention describes a process for the application of a powder coating to a non-conductive substrate by first exposing the non-conductive substrate to a combination of steam and heat at temperatures between 70 ~C and 140 ~C for a period between 5 seconds and up to 10 minutes, followed by electrostatic application of a powder coating to the substrate which is grounded; this simple and reliable pre-treatment method allows an efficient application of powder coatings to non-conductive substrates resulting in uniform and even deposition of the powder coating over the whole surface including edges and with no adverse effects on the subsequent curing of the powder film.

L'invention concerne un procédé d'application d'un revêtement en poudre sur un substrat non conducteur par exposition dudit substrat non conducteur à une combinaison de vapeur et de chaleur à des températures comprises entre 70 ·C et 140 ·C, pendant une durée allant de 5 secondes à 10 minutes, suivie d'une application électrostatique d'un revêtement en poudre sur ledit substrat qui est mis à la terre. Ce procédé de prétraitement simple et fiable permet l'application efficace de revêtements en poudre sur des substrats non conducteurs, ce qui produit un dépôt de revêtement en poudre uniforme et régulier sur la totalité de la surface y compris les bords, et sans effets secondaires sur le durcissement ultérieur du film de poudre.

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