Process for the deposition of metals on semiconductor powders

Details Process for the deposition of metals on semiconductor powders Process for the deposition of metals on semiconductor powders

B - Operations, Transporting

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B05D 3/06 (2006.01) B01J 19/12 (2006.01) C22B 9/22 (2006.01) C22B 15/00 (2006.01) C22B 25/06 (2006.01) C22B 43/00 (2006.01) C23C 18/14 (2006.01)

Patent

CA 1243272

Process for the deposition of metals on semiconductor powders Abstract of the Disclosure Copper, lead, mercury, tin, gold, silver, palladium, osmium and/or cadmium can be deposited by photoredox reaction on semiconductor powders by irradiating a suspension of semi- conductor powder in the presence of: (a) oxygen or mixtures of oxygen and CO2; (b) an oxidisable medium which protects the semiconductor from corrosion and which is selected from water, alkanols containing up to 6 carbon atoms, mixture of water with such an alkanol, or aliphatic or cyclic ethers, mixtures of water and alkali metal sulfites or sulfides, alkaline earth sulfites or sulfides, or water containing acetate buffer; and (c) a salt or complex of copper, lead, mercury, tin, gold, silver, palladium, osmium and/or cadium.

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