Process for the direct metallization of a non-conducting...

Details Process for the direct metallization of a non-conducting... Process for the direct metallization of a non-conducting...

C - Chemistry, Metallurgy

25

D

204/18, 117/75

C25D 5/54 (2006.01) C23C 18/54 (2006.01) C25D 7/12 (2006.01) H05K 3/18 (2006.01)

Patent

CA 2023846

ABSTRACT OF THE DISCLOSURE The present invention relates to a process for the direct metallization of a non-conducting substrate, particularly for the production of printed circuits, which is characterized by the following process steps: pre-cleaning, when required, pre- corroding, pre-swelling the surface to be metallized coating the surface with an adhesive adsorption of a metal compound reaction of the metal compound to the metal galvanic metallization.

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