Process for the hybrid integration of at least one...

Details Process for the hybrid integration of at least one... Process for the hybrid integration of at least one...

G - Physics

02

B

G02B 6/42 (2006.01) G02B 6/12 (2006.01)

Patent

CA 2250517

The invention pertains to a process for the hybrid integration of at least one opto-electronic component (9) and a waveguide (14) provided on a substrate (13), in which process one or more opto-electronic components are provided on a connector piece (6) and the connector piece (6) is placed on the substrate (13) and moved up to the edge of the waveguide (14), with the shape of the connector piece (6) being wholly or largely complementary, and the connector piece (6) when it abuts against the edge of the waveguide (14) having only one degree of freedom in the plane of the substrate (13). The process provides an easy way of producing integrated electro-optical devices.

L'invention porte sur un procédé d'intégration hybride d'au moins un composant opto-électronique (9) et d'un guide d'ondes (14) à un substrat (13). Dans ledit procédé, un ou plusieurs composants opto-électroniques sont placés sur un élément de connexion (6), qui est lui-même placé sur le substrat (13), puis déplacé en remontant le long du bord du guide d'ondes (14), la forme du guide d'ondes et celle de l'élément de connexion (6) étant totalement ou largement complémentaires, et l'élément de connexion (6), lorsqu'il bute sur le bord du guide d'ondes, n'a qu'un seul degré de liberté dans le plan du substrat (13). Ledit procédé est un moyen facile de production de dispositifs électro-optiques intégrés.

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