Process for the manufacture of an electronic component...

Details Process for the manufacture of an electronic component... Process for the manufacture of an electronic component...

H - Electricity

01

F

H01F 37/00 (2006.01) H01L 21/02 (2006.01) H01L 21/70 (2006.01) H01L 27/08 (2006.01) H01L 49/02 (2006.01) H01L 21/288 (2006.01) H01L 21/768 (2006.01)

Patent

CA 2409237

L'invention concerne un procédé permettant de fabriquer des composants électroniques incorporant un micro-composant inductif, disposé au dessus d'un substrat. Un tel composant comporte: - une couche (10) de matériau à faible permittivité relative, reposant sur la face supérieure du substrat (1); - un ensemble de spires métalliques (30-31), définies au-dessus de la couche (10) de matériau à faible permittivité relative; - une couche (15) barrière à la diffusion du cuivre, interposée entre les spires métalliques (30-31) et la couche de matériau à faible permittivité relative.

Affiliated with

Also associated with

Rating

Process for the manufacture of an electronic component... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Process for the manufacture of an electronic component..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process for the manufacture of an electronic component... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1427085