Process for the manufacture of chip boards using...

Details Process for the manufacture of chip boards using... Process for the manufacture of chip boards using...

B - Operations, Transporting

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B

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B32B 21/02 (2006.01) B27N 3/00 (2006.01) C08L 61/06 (2006.01) C08L 97/02 (2006.01) C08L 61/04 (2006.01) C08L 91/06 (2006.01)

Patent

CA 1038744

PROCESS FOR THE MANUFACTURE OF CHIP BOARDS USING CONDENSATION RESINS AS BINDERS AND PRODUCT D#71,200-DTA-88-F ABSTRACT OF THE DISCLOSURE The present invention relates to a process for the manufacture of chip boards especially multi-layer chip boards, using condensation resins as binders, and the products thereof the improvement including melting powdered adhesive particles before applying the adhesive particles to the wood ships. I

216497

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